12+ hour, 43+ min ago   (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...

21+ hour, 36+ min ago   (318+ words) A new contender is entering South Korea’s already fierce chip talent war. According to Newsis and EDAILY, U.S.- headquartered NAND and SSD maker SanDisk is hiring across multiple roles in the country, with expertise in key memory technologies such as…...

4+ day, 4+ hour ago   (461+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50% Rising memory costs are adding…...

4+ day, 13+ hour ago   (281+ words) NVIDIA, already a major memory buyer through its AI accelerators, is tightening memory supply and extending its impact beyond HBM. According to Chosun Biz, the chip giant’s latest neural rendering technology, DLSS 5, is raising the performance bar for PC gaming…...

5+ day, 4+ hour ago   (248+ words) OpenAI is pushing deeper into custom AI silicon, and Samsung may be playing a growing role in its chip ambitions. According to Reuters, Harrison Kim, General Manager of OpenAI Korea, said the two companies have made significant progress in working…...

5+ day, 7+ hour ago   (337+ words) Looking ahead to the third quarter, consumer IC design customers are expected to maintain steady wafer starts amid concerns that mature-process capacity could remain constrained and wafer prices may rise. The seasonal ramp-up of flagship smartphones and growing production of…...

6+ day, 5+ hour ago   (393+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Huawei Reportedly Backs China’s DUV Drive, with 12 Systems Targeted by End-2026; SMIC Testing Underway Huawei is emerging as a…...

1+ week, 12+ hour ago   (369+ words) As AI workloads demand ever more memory, DRAM’s physical capacity ceiling is becoming the bottleneck. At a September 3rd briefing, Japan’s NAND giant detailed how its CXL memory modules expand usable memory capacity while cutting latency by over 90% versus conventional approaches,…...

1+ week, 5+ day ago   (312+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Google Says Memory Tops 75% of Server BOM; TPU-Software Dual Strategy Targets Memory Wall Google has highlighted the growing “memory…...

1+ week, 5+ day ago   (507+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] TSMC Eyes Chip-Level Microchannel Cooling as AI System Power Could Rise 6× in Five Years As AI chip power consumption…...